Rick gets hands-on with the long-in-development Kingdom Under Fire II.
The Ryzen 9 3950X, Intel's Cascade Lake-X, and AMD's 3rd Gen Threadripper will reshape our perceptions of the CPU market.
We've picked some of the best projects recently completed in our project log forum.
16GB and 32GB kits available.
New entry point for HyperX family.
Lower power, faster performance than LPDDR3.
Shortens the tFAW window.
Premium memory at a premium price.
Mass production by 2018 or bust.
3D RAM to hit shop shelves soon.
Plant will be back on-line 'in a short time.'
Huge fire causes complete shutdown of Hynix memory plant.
Crossbar Arrays proved in the fab.
Saves its one-time rival from financial ruin.
Embedded eight-bit system shows promise.
Four-by-four kit for power users.
TSV-based 3D DRAM tech heads to production.
Targets modders with black PCB material.
We put SanDisk's new SSD through our suite of benchmarks to see how it compares.
DRAM arm not quite so lucky, sadly.
Not sharing the details quite yet, though.
Micron has started to ship its first commercial Phase Change Memory (PCM) parts.
Elpida has been saved from the scrapheap thanks to an acquisition by smaller rival Micron.
Researchers at UCL have created the first material which allows ReRAM modules to work at ambient temperatures.
Samsung is targeting consumers in a new advertising campaign for its DRAM and NAND flash products.
Microsoft has joined the Hybrid Memory Cube Consortium, supporting the new HMC RAM technology.
November 13 2019 | 09:50
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